ultrasonic bonding的例句大全

Research on Ultrasonic Bonding to Thick Film An Conductor

厚膜Au导体的超声键合技术研究

These results will be helpful for optimization of the ultrasonic bonding transducer.

这些结论有助于超声键合换能系统的优化。

Research on the Ultrasonic Bonding Method for Polymer Microfluidic Chips

聚合物微流控芯片超声波键合方法研究

Mechanism and Reliability of Lead Free Joints Fabricated by Low Temperature Ultrasonic Bonding

无铅焊点低温超声互连的机理及可靠性研究

Study on Process Model of Ultrasonic Bonding

超声焊接的研究和工艺模型

Study on Interfacial Characteristics and Resistance of Electronic Device during Ultrasonic Bonding

电子器件超声键合接合部形成特征及电性能研究

Design of ultrasonic bonding systems based on mass customization

大规模定制下超声波焊接系统的设计

Ultrasonic wire bonding is one of the most important technologies in chip interconnection of integrated circuits.

超声键合是实现集成电路封装中芯片互连的关键技术之一.

The theoretical analysis and calculation for the amplitude and phase of ultrasonic echoes from the bonding layers of low enriched fuel elements are introduced. The effect of different bonding rates on the amplitude and phase is also described.

给出了低浓铀燃料元件结合层超声反射回波相位幅度信息理论分析和计算方法，也讨论了不同结合率对回波相位与幅度的作用。

Ultrasonic plastic welding ( UPW) is a cost-effective, efficient and clean fusion bonding technique of TPC ( Thermal Plastic Composites), and of great value in application.

超声波塑料焊接是一种经济、高效、环保的热塑性塑料连接新工艺，有极大的推广应用前景。

The automatic position alignment system for the ultrasonic wire bonding machine

超声压焊机自动位置对准系统

Design of welding pressure control system for ultrasonic gold wire bonding machine

超声波金丝球焊线机焊接压力控制系统设计

Development of Control System Used in Ultrasonic Al Wire Bonding Machine

超声波铝线自动邦定机控制系统的研制

The control software for ultrasonic bonding machine is indispensable for the automatic production-lines run by manufactories making microcircuit chips.

超声波焊接机控制软件是国内外生产微电路芯片厂家自动化流水线的不可缺少的一部分。

Analysis on characteristics of input power and interface wedge bonding of Al-Ni ultrasonic aluminum wedge bonds

Al-Ni超声楔焊中输入功率与界面键合的特征分析

The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.

超声功率是影响粗铝丝引线键合强度的最主要因素之一。

Research Status of Reliability and Failure Mechanism of Ultrasonic Ball and Wedge Bonding With Copper Wire

Cu丝超声球焊及楔焊焊点可靠性及失效机理研究

Evolution of the Bond Interface During Ultrasonic Wedge Bonding Process

超声楔键合过程界面接合部演化规律研究

Set up ultrasonic wire bonding laboratory.

成立超声波电子焊接实验室。

The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性.